<p>Key Responsibilities</p> <ul> <li>Deliver practical and theoretical training on IC manufacturing processes such as: </li><li>Wafer handling and preparation </li><li>Die attach, wire bonding, and flip-chip processes </li><li>Encapsulation / molding techniques </li><li>Trimming, forming, and singulation </li><li>Electrical testing, burn-in, and final test </li><li>Train students on semiconductor equipment operation, tool handling, and basic machine troubleshooting. </li><li>Instruct trainees on cleanroom protocols, ESD control, contamination control, and safety practices. </li><li>Demonstrate process flow from wafer to finished IC package and explain yield, defects, and failure modes. </li><li>Conduct hands-on labs, simulations, and process demonstrations as per OSAT curriculum. </li><li>Prepare trainees for OSAT / NSQF-aligned skill assessments through mock tests and skill evaluations. </li><li>Ensure compliance with quality systems such as SPC, SOPs, and basic ISO practices relevant to IC manufacturing. </li><li>Maintain training equipment, ESD stations, and consumables; ensure calibration and readiness. </li><li>Track trainee performance, attendance, and competency development; maintain training documentation. </li><li>Support internal and external assessors during OSAT certification assessments. </li><li>Provide basic orientation on semiconductor industry expectations, shift culture, and shop-floor discipline. </li><li>Coordinate with industry partners, assessment bodies, and placement teams when required. </li></ul> <p>Required Qualifications</p> <ul> <li>ITI / Diploma in Electronics, Electrical, Mechatronics, Instrumentation, or Semiconductor Technology. </li><li>OSAT / NSQF / Semiconductor Skill Certification preferred. </li></ul> <p>Experience</p> <ul> <li>1-5 years of hands-on experience in IC manufacturing, semiconductor assembly & test, or electronics manufacturing. </li><li>Experience in cleanroom or ESD-controlled environments is highly desirable. </li><li>Training or mentoring experience is an added advantage. </li></ul> <p>Technical Skills</p> <ul> <li>Knowledge of semiconductor assembly and test processes. </li><li>Understanding of IC packaging types (DIP, QFN, BGA, CSP, etc.). </li><li>Familiarity with ESD standards, cleanroom protocols, and contamination control. </li><li>Basic understanding of yield, defects, and failure analysis. </li><li>Ability to read process flow diagrams, SOPs, and equipment manuals. </li><li>Basic computer skills for reporting and documentation. </li></ul> <p>Soft Skills</p> <ul> <li>Clear communication and demonstration skills. </li><li>Strong discipline and safety-first mindset. </li><li>Patience and ability to train entry-level candidates. </li><li>Willingness to upgrade skills with evolving semiconductor technologies. </li></ul> <p>Work Environment</p> <ul> <li>Training labs simulating cleanroom and IC manufacturing environments. </li><li>May require extended hours during assessments or industry-aligned programs. </li></ul> <p>Key Performance Indicators (KPIs)</p> <ul> <li>Trainee competency and OSAT assessment success rate. </li><li>Compliance with cleanroom, ESD, and safety standards. </li><li>Equipment uptime and lab readiness. </li><li>Trainee feedback and placement readiness in semiconductor roles. </li></ul> <p>Key Responsibilities</p> <ul> <li>Deliver practical and theoretical training on IC manufacturing processes such as: </li><li>Wafer handling and preparation </li><li>Die attach, wire bonding, and flip-chip processes </li><li>Encapsulation / molding techniques </li><li>Trimming, forming, and singulation </li><li>Electrical testing, burn-in, and final test </li><li>Train students on semiconductor equipment operation, tool handling, and basic machine troubleshooting. </li><li>Instruct trainees on cleanroom protocols, ESD control, contamination control, and safety practices. </li><li>Demonstrate process flow from wafer to finished IC package and explain yield, defects, and failure modes. </li><li>Conduct hands-on labs, simulations, and process demonstrations as per OSAT curriculum. </li><li>Prepare trainees for OSAT / NSQF-aligned skill assessments through mock tests and skill evaluations. </li><li>Ensure compliance with quality systems such as SPC, SOPs, and basic ISO practices relevant to IC manufacturing. </li><li>Maintain training equipment, ESD stations, and consumables; ensure calibration and readiness. </li><li>Track trainee performance, attendance, and competency development; maintain training documentation. </li><li>Support internal and external assessors during OSAT certification assessments. </li><li>Provide basic orientation on semiconductor industry expectations, shift culture, and shop-floor discipline. </li><li>Coordinate with industry partners, assessment bodies, and placement teams when required. </li></ul> <p>Required Qualifications</p> <ul> <li>ITI / Diploma in Electronics, Electrical, Mechatronics, Instrumentation, or Semiconductor Technology. </li><li>OSAT / NSQF / Semiconductor Skill Certification preferred. </li></ul> <p>Experience</p> <ul> <li>1-5 years of hands-on experience in IC manufacturing, semiconductor assembly & test, or electronics manufacturing. </li><li>Experience in cleanroom or ESD-controlled environments is highly desirable. </li><li>Training or mentoring experience is an added advantage. </li></ul> <p>Technical Skills</p> <ul> <li>Knowledge of semiconductor assembly and test processes. </li><li>Understanding of IC packaging types (DIP, QFN, BGA, CSP, etc.). </li><li>Familiarity with ESD standards, cleanroom protocols, and contamination control. </li><li>Basic understanding of yield, defects, and failure analysis. </li><li>Ability to read process flow diagrams, SOPs, and equipment manuals. </li><li>Basic computer skills for reporting and documentation. </li></ul> <p>Soft Skills</p> <ul> <li>Clear communication and demonstration skills. </li><li>Strong discipline and safety-first mindset. </li><li>Patience and ability to train entry-level candidates. </li><li>Willingness to upgrade skills with evolving semiconductor technologies. </li></ul> <p>Work Environment</p> <ul> <li>Training labs simulating cleanroom and IC manufacturing environments. </li><li>May require extended hours during assessments or industry-aligned programs. </li></ul> <p>Key Performance Indicators (KPIs)</p> <ul> <li>Trainee competency and OSAT assessment success rate. </li><li>Compliance with cleanroom, ESD, and safety standards. </li><li>Equipment uptime and lab readiness. </li><li>Trainee feedback and placement readiness in semiconductor roles. </li></ul> <p>Learn More about TATA Electronics</p> <p>Go to website</p> <p>Learn More About Tata Electronics</p> <p>Apply now "</p> <p>Find similar jobs:</p>