<p>Job Summary:</p> <p>We are seeking a highly skilled and motivated Advanced Packaging Engineer with hands-on experience in relevant technologies. The successful candidate will be responsible for the development, optimization, and sustaining of advanced packaging solutions.</p> <p>Key Responsibilities:</p> <ul> <li>Lead process development and optimization of IC packaging processes (e.g., compression mold, ball attach, laser groove, dicing, die attach, die prep, tape & reel, backgrinding / thinning. </li><li>Define and execute DOE (Design of Experiments) for new materials and process evaluations. </li><li>Establish process windows and control limits; develop process documentation including FMEA and control plans. </li><li>Support new product introductions and ramp to production by collaborating closely with manufacturing and product teams. </li><li>Identify root causes and drive corrective actions for yield and reliability issues. </li><li>Troubleshoot process issues, providing continuous improvements to yield, quality, and cycle time. </li><li>Work with tool vendors and material suppliers to develop next generation technologies. </li><li>Maintain clear documentation of process changes, results, and improvements through review & control processes. </li><li>Present findings and suggest improvements to leadership teams. </li></ul> <p>Required Qualifications:</p> <ul> <li>At least 5-10 years of hands-on experience in semiconductor packaging process development (e.g., compression mold, ball attach, laser groove, dicing, die attach, die prep, tape & reel & backgrinding / thinning). </li><li>Knowledge of JEDEC reliability testing and associated failure modes & remedies. </li><li>Familiarity with materials used in FOWLP/FOPLP ball attach and RDL is an added advantage. </li><li>Solid understanding of failure analysis and troubleshooting with 8D, Six sigma processes. </li><li>Strong problem-solving skills and a detail-oriented approach is needed. </li><li>Ability to communicate technical concepts clearly to both technical and non-technical stakeholders. </li><li>Strong teamwork, collaboration, and interpersonal skills is required. </li><li>Ability to work in a fast-paced, cross-functional team environment. </li><li>BS, MS or PhD degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, or a related field. </li><li>US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship. </li></ul>