<p>We are looking for an Optical Packaging Engineer. In this role, you'll be part of a cross-functional team whose mission is to lead IonQ on its journey to build the world's best quantum computers to solve the world's most complex problems.</p> <p>IonQ is hiring an optical and packaging engineer to accelerate deployment of this technology, for both our internal efforts and to help provide this enabling capability to the quantum and classical photonics communities. In this job you will work with a leading team of quantum optics and photonics experts to package and deploy novel integrated photonic devices in cryogenic environments.</p> <p>Responsibilities:</p> <ul> <li>Build on IonQ's established process to standardize, test, and optimize tools and techniques for low-loss, cryo-compatible optical packaging to help bring this capability to customers across industry, the public sector, and academia. </li><li>Develop processes and metrics to evaluate and monitor process yields and bottlenecks. </li><li>Collaborate with research and business development teams to develop new packaging capabilities and mature them into standard processes. </li></ul> <p>You'd be a good fit with:</p> <ul> <li>Bachelor's degree in engineering, physics, optics, or related field + 3 years of industry experience developing and deploying photonic devices in an industry setting or a PhD in engineering, physics, optics, or related field. </li><li>Hands on experience performing nanofabrication or optical packaging tasks </li><li>Hands on experience working with fiber optics or integrated photonic devices </li><li>Experience using CAD software to develop hardware prototypes and systems </li></ul> <p>You'd be a great fit with:</p> <ul> <li>Bachelor's degree in engineering, physics, optics or related field + 5 years of industry experience developing and deploying photonic devices in an industry setting or a PhD in engineering, physics, optics, or related field + 2 years of industry experience developing and deploying photonic devices in an industry setting. Experience working in OSAT (Outsourced Semiconductor Assembly & Test) or adjacent industry is a plus. </li><li>Hands on experience with fiber packaging, packaging process development, photonic design, high precision fiber alignment, or optical adhesive dispensing. </li><li>Demonstrated track record of testing and deploying novel integrated photonic devices in cryogenic or otherwise exotic environments </li></ul> <p>Location: This role can work onsite or hybrid from our office in Boston, MA.</p> <p>Travel: Minimal to none.</p> <p>Job ID: 1066</p> <p>The approximate base salary range for this position is $107,123 - $140,251. The total compensation package includes base, bonus, and equity.</p>