<p>Summary: Our Internship program offers students an opportunity to receive training in a professional environment. Throughout your internship you will gain on-the-job experience while working along side experienced professionals who provide you with both guidance and autonomy as you work on challenging projects. Our internship programs run typically May - August each year.</p> <p>Project and responsibilities: Characterize process parameters for our bonding chambers and associated processes alongside the bonding engineering team. Work closely with the technology integration teams to provide critical data and analysis for decision making. Use project management techniques to manage risk and timelines while getting first hand experience in technology development projects.</p> <ul> <li>Process development for wafer to wafer hybrid bonding and other advanced packaging technologies </li><li>Design experiments for next generation Heterogenous Integration process development </li><li>Acquire and analyze experimental data, publish findings internally </li><li>Develop process flows and run lots while working with experienced engineering staff </li><li>Learn and apply DOE, SPC and Six Sigma methodologies </li></ul> <p>Required Qualifications:</p> <p>Degree Program: Completion of Junior year + in a bachelors' degree program in the areas of Science, Technology, Engineering or Math.</p> <p>Skills & Coursework: Statistics, Mechanical Engineering or Materials Science</p> <p>U.S. Person Required: SkyWater Technology Foundry, Inc. is subject to the International Traffic in Arms Regulations (ITAR). All accepted applications must be U.S. Persons as defined by ITAR. ITAR defines a U.S. Person as U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee.</p>