<p>Change the world. Love your job.</p> <p>A CMP Process Development Engineer is responsible for the development, characterization and optimization of embedded processors to meet the requirements for volume production as part of the Advanced Technology Development team. The ideal candidate will be a technical leader in the area of embedded processors driving the characterization and optimization of the device and process to insure robustness, reliability, and manufacturability meeting all electrical device performance targets.</p> <p>Responsibilities include:</p> <ul> <li>Drive process and device improvements through characterization, test, design of experiments, data analysis and simulation </li><li>Work with multiple process, integration, reliability, packaging and test engineers to achieve these goals </li><li>Work closely with the product groups to identify and optimize the embedded processor performance to meet critical final device parameters to enable game changing products in the market </li><li>Compile and evaluate test data to determine appropriate limits and variables for process or material specifications </li><li>Conceive and plan projects involving definition and selection of new concepts, equipment, chemistry, automation, or approaches in the development of new processes </li><li>Provide technical engineering support in the manufacturing area </li><li>Recommend and implement equipment and process modifications to improve production efficiencies, manufacturing techniques, fundamental capabilities and production yields for existing products </li><li>Partners with vendors to define and execute on equipment and process development roadmaps </li></ul> <p>The person performing this role must be capable of planning effectively, driving schedules, meeting critical deadlines on multiple tasks in parallel, leading technical discussions in their area of expertise, and working effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.</p> <p>Minimum requirements:</p> <ul> <li>Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material Science, or other related degree </li><li>5 years of experience working on CMP processes </li><li>28nm node semiconductor process experience </li></ul> <p>Preferred qualifications:</p> <ul> <li>PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material Science, or other related degree </li><li>Strongly prefer experience with HKMG CMP, TiN CMP, Poly CMP, CuCMP, and/or NVM like ReRAM/CBRAM/FRAM </li><li>Excellent understanding of WLEP systems and demonstrated experience of building white light based endpoints </li><li>Demonstrated experience with organic film CMP such as resist and/or BARC </li><li>Working knowledge of advanced CMOS device physics and reliability mechanisms in advanced logic and CMOS technologies </li><li>Experience across multiple 300mm CMP platforms </li><li>Experience driving vendor engagement to leverage best in class tool and chemistry needs </li><li>Previous direct R&D experience in 300mm semiconductors </li><li>Device physics training with understanding of materials and electrical test characterization </li><li>Ability to establish strong relationships with key stakeholders critical to success, both internally and externally </li><li>Strong verbal and written communication skills </li><li>Ability to quickly ramp on new systems and processes </li><li>Demonstrated strong interpersonal, analytical and problem-solving skills </li><li>Ability to work in teams and collaborate effectively with people in different functions </li><li>Ability to take the initiative and drive for results </li><li>Strong time management skills that enable on-time project delivery </li></ul> <p>Minimum requirements:</p> <ul> <li>Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material Science, or other related degree </li><li>5 years of experience working on CMP processes </li><li>28nm node semiconductor process experience </li></ul> <p>Preferred qualifications:</p> <ul> <li>PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material Science, or other related degree </li><li>Strongly prefer experience with HKMG CMP, TiN CMP, Poly CMP, CuCMP, and/or NVM like ReRAM/CBRAM/FRAM </li><li>Excellent understanding of WLEP systems and demonstrated experience of building white light based endpoints </li><li>Demonstrated experience with organic film CMP such as resist and/or BARC </li><li>Working knowledge of advanced CMOS device physics and reliability mechanisms in advanced logic and CMOS technologies </li><li>Experience across multiple 300mm CMP platforms </li><li>Experience driving vendor engagement to leverage best in class tool and chemistry needs </li><li>Previous direct R&D experience in 300mm semiconductors </li><li>Device physics training with understanding of materials and electrical test characterization </li><li>Ability to establish strong relationships with key stakeholders critical to success, both internally and externally </li><li>Strong verbal and written communication skills </li><li>Ability to quickly ramp on new systems and processes </li><li>Demonstrated strong interpersonal, analytical and problem-solving skills </li><li>Ability to work in teams and collaborate effectively with people in different functions </li><li>Ability to take the initiative and drive for results </li><li>Strong time management skills that enable on-time project delivery </li></ul>