<p>We are seeking a skilled and experienced IR Analysis Engineer to join our team, specializing in System-on-Chip (SoC) and Interposer designs. As an IR Analysis Engineer, you will be responsible for analyzing and optimizing power integrity and signal integrity in complex integrated circuits. The ideal candidate will have a strong background in IR analysis methodologies, with a focus on SoC and Interposer designs.</p> <ul> <li> <p>Perform power integrity analysis to ensure robust power delivery network (PDN) design and optimization</p> </li><li> <p>Collaborate with the design and physical implementation teams to develop and validate IR analysis methodologies</p> </li><li> <p>Conduct package-level and board-level analysis to address IR challenges and optimize power distribution</p> </li><li> <p>Identify and resolve IR-related issues, including voltage drop, electro-migration, power noise, and cross-talk</p> </li><li> <p>Work closely with the design and layout teams to optimize power grid design and component placement</p> </li><li> <p>Develop and maintain IR analysis methodologies, flows, and best practices for SoC and Interposer designs</p> </li><li> <p>Drive and support IR-related tool evaluations, methodology enhancements, and design optimizations</p> </li><li> <p>Engineering degree in a relevant field, or equivalent experience</p> </li><li> <p>Strong understanding of power integrity and signal integrity concepts and challenges with power gated designs</p> </li><li> <p>Proficient in using industry-standard EDA tools for IR analysis, such as Voltus, Redhawk, or equivalent</p> </li><li> <p>Experience with IR analysis at the package-level and board-level</p> </li><li> <p>Knowledge of power delivery network (PDN) design and optimization techniques</p> </li><li> <p>Familiarity with IR-related issues and their impact on circuit performance and reliability</p> </li><li> <p>Proficiency in using scripting languages such as Tcl or Python for automation and data analysis</p> </li><li> <p>Experience with interposer design and analysis is preferred</p> </li><li> <p>Knowledge of advanced packaging technologies, such as 2.5D and 3D integration is preferred</p> </li><li> <p>Familiarity with electromagnetic (EM) analysis tools and methodologies is preferred</p> </li></ul>